HeatShield1200 is a high-temperature-resistant, low-viscosity SLA resin with a semi-transparent color. Models printed with this material can be used in environments of approximately 120°C, with momentary temperature resistance exceeding 200°C.

It exhibits dimensional stability, is resistant to deformation, and features fine surface details. Widely used for applications requiring high-temperature resistance, it is also suitable for rapid molds with certain materials, facilitating small-batch production.

Resin-Clear

PMMA-Like Semi-translucent Resin

HeatShield1200 withstands high temperatures, ensuring durability and fine details.
High Temperature Resistance
Excellent Dimensional Stability
  • Resin-Clear
<
>
Liquid Properties

 

Color Semi-translucent
Density (g/cm³) 1.14g/cm³ @ 25°C
Viscosity 340 cps @28°C

 

 

Optical Properties

 

Dp 0.115 mm
Ec 13.5 mJ/cm²
Building Layer Thickness 0.08-0.12 mm

 

 

Mechanical Properties

 

Tensile Strength ASTM D 638 65MPa GB/T1040.1-2006 71MPa
Elongation at break ASTM D 638 3-5% GB/T1040.1-2006 3-5%
Bending strength ASTM D 790 110MPa GB/ T9341-2008 115MPa
Flexural modulus ASTM D 790 2720MPa GB/ T9341-2008 2850MPa
Izod notched impact strength ASTM D 256 20J/m GB/T1843-2008 25J/m
Shore hardness ASTM D 2240 87D GB/T2411-2008 87D
Glass transition temperature DMA, tan θ peak 135℃ 58-70 58-70
Thermal expansion coefficient(25-50℃) ASTME831-05 50 µ m/m℃ GB/T1036-89 50 µ m/m℃
Thermal expansion coefficient(50-100℃) ASTME831-05 150 µ m/m℃ GB/T1036-89 16 µ m/m℃
Return