HeatShield1200 is a high-temperature-resistant, low-viscosity SLA resin with a semi-transparent color. Models printed with this material can be used in environments of approximately 120°C, with momentary temperature resistance exceeding 200°C.
It exhibits dimensional stability, is resistant to deformation, and features fine surface details. Widely used for applications requiring high-temperature resistance, it is also suitable for rapid molds with certain materials, facilitating small-batch production.
PMMA-Like Semi-translucent Resin
HeatShield1200 withstands high temperatures, ensuring durability and fine details.
High Temperature Resistance
Excellent Dimensional Stability
Liquid Properties
Color | Semi-translucent |
Density (g/cm³) | 1.14g/cm³ @ 25°C |
Viscosity | 340 cps @28°C |
Optical Properties
Dp | 0.115 mm |
Ec | 13.5 mJ/cm² |
Building Layer Thickness | 0.08-0.12 mm |
Mechanical Properties
Tensile Strength | ASTM D 638 | 65MPa | GB/T1040.1-2006 | 71MPa |
Elongation at break | ASTM D 638 | 3-5% | GB/T1040.1-2006 | 3-5% |
Bending strength | ASTM D 790 | 110MPa | GB/ T9341-2008 | 115MPa |
Flexural modulus | ASTM D 790 | 2720MPa | GB/ T9341-2008 | 2850MPa |
Izod notched impact strength | ASTM D 256 | 20J/m | GB/T1843-2008 | 25J/m |
Shore hardness | ASTM D 2240 | 87D | GB/T2411-2008 | 87D |
Glass transition temperature | DMA, tan θ peak | 135℃ | 58-70 | 58-70 |
Thermal expansion coefficient(25-50℃) | ASTME831-05 | 50 µ m/m℃ | GB/T1036-89 | 50 µ m/m℃ |
Thermal expansion coefficient(50-100℃) | ASTME831-05 | 150 µ m/m℃ | GB/T1036-89 | 16 µ m/m℃ |
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